Kenwei invite you to participate in the PACK EXPO 2018 in Chicago
Professional manufacturing, excellent quality, integrity management!
Host time:OCT 14, 2018 - OCT 17, 2018
Venue:McCormick Place Chicago, IL USA
Booth：E-8461: KENWEI/Zhongshan Multiweigh Packaging Machinery Co., Ltd.
For end users and suppliers from around the world, the PACK EXPO name stands for a quality tradeshow experience and a wide range of processing and packaging innovations for every vertical market.
The United States International Packaging Fair is sponsored by PMMI American Packaging Machinery Manufacturing Association. It is held annually in Chicago and Las Vegas in the United States. Since the first successful held in 1995, it has developed into the largest packaging exhibition in North America. It is a very influential professional exhibition in the international packaging exhibition. In 2017, the United States PACK EXPO exhibition area of more than 130,000 square meters, occupying the United States Las Vegas International Exhibition Center three exhibition halls, nearly 2,400 exhibitors, 19% more than the 2014 exhibition, professional audience 65,000. In view of the success of the American Packaging Exhibition in 2017, many exhibitors immediately decided to sign up for the next American International Packaging Exhibition in Chicago on the closing day.
You are welcome to come to Kenwei booth!
AI automatic generation Description: our company is located in areas with convenient transportation and developed economy. Our products are supplied in a timely manner. In the course of business operation, we always focus on customers.
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